<?xml version="1.0" encoding="UTF-8"?><rss xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:content="http://purl.org/rss/1.0/modules/content/" xmlns:atom="http://www.w3.org/2005/Atom" version="2.0"><channel><title><![CDATA[Simple Tech Trend]]></title><description><![CDATA[Simple Tech and Trend]]></description><link>https://www.simpletechtrend.com/blog</link><generator>RSS for Node</generator><lastBuildDate>Tue, 05 May 2026 08:55:51 GMT</lastBuildDate><atom:link href="https://www.simpletechtrend.com/blog-feed.xml" rel="self" type="application/rss+xml"/><item><title><![CDATA[2026 AI 基建必看！光通訊與 CPO 產業鏈全圖 (附最新概念股名單) - Simple Tech Trend]]></title><description><![CDATA[獨家整理 2026 年最新光通訊與 CPO 矽光子產業鏈全圖。從 EIC 設計、光電元件製造到光模塊與先進封測，一網打盡 NVIDIA、台積電等關鍵供應鏈與潛力新創，帶你掌握 AI 基礎建設的最強投資矩陣。]]></description><link>https://www.simpletechtrend.com/post/cpo-silicon-photonics-supply-chain-map-2026</link><guid isPermaLink="false">69ea9090ab5395dde60997e6</guid><category><![CDATA[Technical Articles]]></category><pubDate>Thu, 23 Apr 2026 21:38:04 GMT</pubDate><enclosure url="https://static.wixstatic.com/media/82206f_bf448d05c21c46aea532a7dac79d2f09~mv2.jpg/v1/fit/w_1000,h_1000,al_c,q_80/file.png" length="0" type="image/png"/><dc:creator>simpletechtrend</dc:creator></item><item><title><![CDATA[法說精華：Fabrinet（FN）｜FY26 Q3]]></title><description><![CDATA[營收獲利雙破紀錄！Fabrinet 雖然面臨 Datacom 零組件缺料壓力，但在 DCI 與 HPC 強勁拉貨下表現亮眼。更重要的是，FN 宣佈切入 Hyperscaler 直供供應鏈，並透過戰略投資 Raytek 進軍 CPO 領域。]]></description><link>https://www.simpletechtrend.com/post/fy26-q3-fabrinet-earnings-analysis-cpo-dci-growth</link><guid isPermaLink="false">69f93405b27e981e27c56b93</guid><category><![CDATA[Earnings Call]]></category><pubDate>Tue, 05 May 2026 00:09:01 GMT</pubDate><enclosure url="https://static.wixstatic.com/media/82206f_1a3f159f9cf64095a91f39cb180df23e~mv2.jpg/v1/fit/w_765,h_1000,al_c,q_80/file.png" length="0" type="image/png"/><dc:creator>simpletechtrend</dc:creator></item><item><title><![CDATA[技術文章分析 | Google 第八代 TPU 雙架構解析：TPU 8t 與 TPU 8i 如何解決 Agentic AI 的算力瓶頸]]></title><description><![CDATA[Google 第八代 TPU 首度採用雙架構策略！本文由 STT 深入解析 TPU 8t 如何突破訓練 I/O 瓶頸，以及 TPU 8i 如何利用大容量 SRAM 與 OCS 光電路交換技術，將 MoE 推理的網路延遲大幅降低 56%，完美應對 Agentic AI 的算力挑戰。]]></description><link>https://www.simpletechtrend.com/post/google-tpu-8t-8i-architecture-deep-dive</link><guid isPermaLink="false">69f8589f7b1c42fb24f9ffe6</guid><category><![CDATA[Technical Articles]]></category><pubDate>Mon, 04 May 2026 08:30:42 GMT</pubDate><enclosure url="https://static.wixstatic.com/media/82206f_62dfc22c05ea4a3fa1559b98d4bc0b9f~mv2.png/v1/fit/w_1000,h_1000,al_c,q_80/file.png" length="0" type="image/png"/><dc:creator>simpletechtrend</dc:creator></item><item><title><![CDATA[技術文章分析 | 突破 100GHz 瓶頸：GPU 叢集 400G/lane EML 與先進封裝技術]]></title><description><![CDATA[AI 算力狂飆帶動 3.2T 光通訊時代來臨！本文深度解析 Mitsubishi Electric 最新論文，看他們如何透過 0.8um 極限高台地 EML 晶片設計，搭配創新的 Glass-AlN 混合基板與去打線封裝技術，成功突破 100GHz 頻寬天險，為下一代 CPO 與 GPU 叢集鋪平道路。]]></description><link>https://www.simpletechtrend.com/post/mitsubishi-eml-400g-lane-cpo-packaging</link><guid isPermaLink="false">69f851a75caf4ed272b97729</guid><category><![CDATA[Technical Articles]]></category><pubDate>Mon, 04 May 2026 08:07:56 GMT</pubDate><enclosure url="https://static.wixstatic.com/media/82206f_d2316278a3954b2185f1b0065a4dca1d~mv2.png/v1/fit/w_469,h_845,al_c,q_80/file.png" length="0" type="image/png"/><dc:creator>simpletechtrend</dc:creator></item><item><title><![CDATA[法說精華：AXT（AXTI）｜FY26 Q1]]></title><description><![CDATA[AI 狂潮引爆光通訊基板需求！AXT 在 EML 與矽光子強勢帶動下，InP 積壓訂單破億美元，未來產能將如何翻倍支援 CPO 時代？為您解析最新法說重點。]]></description><link>https://www.simpletechtrend.com/post/axt-earnings-fy26-q1-inp-cpo-analysis</link><guid isPermaLink="false">69f5b13aedf5696920d3f8d1</guid><category><![CDATA[Earnings Call]]></category><pubDate>Sat, 02 May 2026 08:13:30 GMT</pubDate><enclosure url="https://static.wixstatic.com/media/82206f_1a3f159f9cf64095a91f39cb180df23e~mv2.jpg/v1/fit/w_765,h_1000,al_c,q_80/file.png" length="0" type="image/png"/><dc:creator>simpletechtrend</dc:creator></item><item><title><![CDATA[法說精華：Corning（GLW）｜FY26 Q1]]></title><description><![CDATA[康寧（Corning）不再只是玻璃龍頭！受惠 AI 帶動的光通訊需求與太陽能業務爆發，康寧宣布二度上修成長計畫至 2030 年。在 Meta 訂單之外，更多超大規模客戶加入，顯示康寧已成為 AI 基礎建設的關鍵硬體支柱。]]></description><link>https://www.simpletechtrend.com/post/q1-2026-corning-earnings-ai-optical-solar-growth</link><guid isPermaLink="false">69f155d621c82a1db67e3314</guid><category><![CDATA[Earnings Call]]></category><pubDate>Wed, 29 Apr 2026 00:54:28 GMT</pubDate><enclosure url="https://static.wixstatic.com/media/82206f_1a3f159f9cf64095a91f39cb180df23e~mv2.jpg/v1/fit/w_765,h_1000,al_c,q_80/file.png" length="0" type="image/png"/><dc:creator>simpletechtrend</dc:creator></item><item><title><![CDATA[法說精華：Nokia（NOK）｜FY26 Q1]]></title><description><![CDATA[I 流量衝擊網路架構！Nokia Q1 亮點不在傳統電信，而是 AI/Cloud 客戶高達 49% 的營收成長。隨聖荷西 InP 新廠即將投產，Nokia 如何利用垂直整合優勢，在 800G 浪潮中超車？]]></description><link>https://www.simpletechtrend.com/post/nokia-fy26-q1-ai-infrastructure-optical-growth-inp-update</link><guid isPermaLink="false">69efee547475e016cb924253</guid><category><![CDATA[Earnings Call]]></category><pubDate>Mon, 27 Apr 2026 23:23:58 GMT</pubDate><enclosure url="https://static.wixstatic.com/media/82206f_1a3f159f9cf64095a91f39cb180df23e~mv2.jpg/v1/fit/w_765,h_1000,al_c,q_80/file.png" length="0" type="image/png"/><dc:creator>simpletechtrend</dc:creator></item><item><title><![CDATA[Simple Tech Trend 網站導覽]]></title><description><![CDATA[Simple Tech Trend 網頁導覽]]></description><link>https://www.simpletechtrend.com/post/simple-tech-trend-guideline</link><guid isPermaLink="false">69e9a4e6d06bed7d1a9fdc94</guid><pubDate>Thu, 23 Apr 2026 05:15:25 GMT</pubDate><enclosure url="https://static.wixstatic.com/media/82206f_1a3f159f9cf64095a91f39cb180df23e~mv2.jpg/v1/fit/w_765,h_1000,al_c,q_80/file.png" length="0" type="image/png"/><dc:creator>simpletechtrend</dc:creator></item><item><title><![CDATA[技術文章分析 | A Symmetrical, Wavelength Agnostic, Bidirectional, Silicon-Photonic Link Proposal and Demonstration| NVIDIA]]></title><description><![CDATA[NVIDIA 提出全新「對稱式、無關波長」的矽光子雙向通訊架構，透過偏振多工技術解決傳統 CPO 面臨的埠數與成本瓶頸。實測在 32Gbps 下雙向傳輸零失誤，徹底實現光通訊設備的「無色化」，為 AI 算力叢集的網路擴充鋪平道路。]]></description><link>https://www.simpletechtrend.com/post/nvidia-siph-bidi-polarization-multiplexing-architecture</link><guid isPermaLink="false">69d44961d142869289e93112</guid><category><![CDATA[Technical Articles]]></category><pubDate>Tue, 07 Apr 2026 00:07:05 GMT</pubDate><enclosure url="https://static.wixstatic.com/media/82206f_bacf2bef365745f28cdcaeca83715ef1~mv2.png/v1/fit/w_541,h_508,al_c,q_80/file.png" length="0" type="image/png"/><dc:creator>simpletechtrend</dc:creator></item><item><title><![CDATA[破局 AI 算力瓶頸：透視 OCS 應用與 1.6T 時代的光通訊技術革命]]></title><description><![CDATA[AI 算力流量暴增，OCS (光電路交換) 如何取代 Spine 層傳統電交換機？本文深度解析 1.6T 時代的光鏈路挑戰，透視 WDM、Circulator 關鍵元件，以及 Coherent-Lite 相干技術的降維打擊優勢。]]></description><link>https://www.simpletechtrend.com/post/ocs-coherent-lite-1-6t-optical-network</link><guid isPermaLink="false">69d1202ecc46c6bc6b9f421a</guid><category><![CDATA[Technical Articles]]></category><pubDate>Sat, 04 Apr 2026 14:44:08 GMT</pubDate><enclosure url="https://static.wixstatic.com/media/82206f_e1cc60589b9c409c9ab0ac4efd2703de~mv2.png/v1/fit/w_353,h_209,al_c,q_80/file.png" length="0" type="image/png"/><dc:creator>simpletechtrend</dc:creator></item><item><title><![CDATA[矽光子量產革命：AI 數據中心的光學未來全解析]]></title><description><![CDATA[生成式AI引爆算力需求，矽光子(Silicon Photonics)成為突破傳輸極限的關鍵。本文深度解析台積電COUPE技術、聯鈞光電ELSFP封裝、多核心光纖及自動化測試，帶您一窺光通訊產業鏈的量產佈局與未來規格。]]></description><link>https://www.simpletechtrend.com/post/https-www-drflyout-com-silicon-photonics-ai-data-center-cpo-tsmc</link><guid isPermaLink="false">69cc644b7d31fe550c65387a</guid><category><![CDATA[Tech Conference Notes]]></category><pubDate>Wed, 01 Apr 2026 00:21:46 GMT</pubDate><enclosure url="https://static.wixstatic.com/media/82206f_09098bf1e70741c29e2f2c4439baf21b~mv2.png/v1/fit/w_1000,h_960,al_c,q_80/file.png" length="0" type="image/png"/><dc:creator>simpletechtrend</dc:creator></item><item><title><![CDATA[技術文章分析 | 突破 400G 單波極限：IM/DD 互連技術的組件與系統權衡 | Coherent]]></title><description><![CDATA[單波 400G 時代來臨！Coherent 在 OFC 2026 展示了頻寬破 100 GHz 的 InP 組件，如何在維持低 TDECQ 的同時，克服 5 dB 的靈敏度懲罰？這是一場關於 AI 算力互連的極限挑戰，深度解析 IM/DD 技術的商業與技術權衡。]]></description><link>https://www.simpletechtrend.com/post/ofc2026-coherent-400g-imdd-component-tradeoffs</link><guid isPermaLink="false">69cb30cf138134f817297d84</guid><category><![CDATA[Technical Articles]]></category><pubDate>Tue, 31 Mar 2026 02:30:10 GMT</pubDate><enclosure url="https://static.wixstatic.com/media/82206f_06338cec26e8445b97531185c976306a~mv2.png/v1/fit/w_470,h_131,al_c,q_80/file.png" length="0" type="image/png"/><dc:creator>simpletechtrend</dc:creator></item><item><title><![CDATA[技術文章分析 | Broadcom 200G VCSEL 深度解析：AI 擴展網路的「省電神兵」NPO]]></title><description><![CDATA[Broadcom 揭曉 200G VCSEL 最新突破！實測 35 GHz 高頻寬與 1 pJ/bit 極致能效，搭配全新 NPO 架構，正準備在 AI Scale-Up 網路中徹底取代傳統銅纜。]]></description><link>https://www.simpletechtrend.com/post/broadcom-200g-vcsel-npo-ai-networking</link><guid isPermaLink="false">69c9c46dfcaccefbd361409e</guid><category><![CDATA[Technical Articles]]></category><pubDate>Mon, 30 Mar 2026 00:41:00 GMT</pubDate><enclosure url="https://static.wixstatic.com/media/82206f_8e3473eea0674d769adc9026ecea4124~mv2.png/v1/fit/w_825,h_355,al_c,q_80/file.png" length="0" type="image/png"/><dc:creator>simpletechtrend</dc:creator></item><item><title><![CDATA[技術文章分析 | 矽光子微環調製器的 200Gb/s 時代：NVIDIA 的設計美學與權衡之道]]></title><description><![CDATA[NVIDIA 在 OFC 2026 深度揭秘單路 200Gb/s 矽光子微環調製器的設計核心！本文拆解 3D IC 集成、電感峰值技術與 PN 結性能權衡，帶你掌握 AI 算力工廠 CPO 互連的關鍵技術路徑。]]></description><link>https://www.simpletechtrend.com/post/ofc2026-nvidia-silicon-photonics-mrm-200g-analysis</link><guid isPermaLink="false">69c67bc2495b6130434e5962</guid><category><![CDATA[Technical Articles]]></category><pubDate>Fri, 27 Mar 2026 12:48:27 GMT</pubDate><enclosure url="https://static.wixstatic.com/media/82206f_1217320d77684b2a8ef70056349e6c92~mv2.png/v1/fit/w_508,h_162,al_c,q_80/file.png" length="0" type="image/png"/><dc:creator>simpletechtrend</dc:creator></item><item><title><![CDATA[技術文章分析 | 300mm 矽光子平台的逆襲：500微米超緊湊 MZM 挑戰單路 400Gbps 極限]]></title><description><![CDATA[誰說 MZM 一定要長如龍？張江實驗室在 OFC 2026 展示了利用「慢光」效應將調變器縮減至 500 微米，並在不依賴 AI 演算法的情況下衝上單路 400 Gbps 的驚人成果！]]></description><link>https://www.simpletechtrend.com/post/ofc2026-compact-500um-mzm-400gbps-silicon-photonics</link><guid isPermaLink="false">69c67a03a937958fa7dc8224</guid><category><![CDATA[Technical Articles]]></category><pubDate>Fri, 27 Mar 2026 12:42:09 GMT</pubDate><enclosure url="https://static.wixstatic.com/media/82206f_71f62923b32f4688b43a9790eca26f69~mv2.png/v1/fit/w_474,h_229,al_c,q_80/file.png" length="0" type="image/png"/><dc:creator>simpletechtrend</dc:creator></item><item><title><![CDATA[技術文章分析 | 整合玻璃波導基板與表面耦合光學晶片實現 CPO 大規模縮放]]></title><description><![CDATA[玻璃基板要翻身了！康寧最新論文展示了具備 IOX 波導與電氣互連的玻璃中介層，讓矽光子 PIC 組裝比煮泡麵還快，還能達成 8 Tb/s 的超狂頻寬密度，這就是 AI 時代的互連神兵。]]></description><link>https://www.simpletechtrend.com/post/ofc2026-corning-glass-waveguide-cpo-scaling</link><guid isPermaLink="false">69c38561149f4fed56511dcf</guid><category><![CDATA[Technical Articles]]></category><pubDate>Wed, 25 Mar 2026 06:52:44 GMT</pubDate><enclosure url="https://static.wixstatic.com/media/82206f_45c12a194ec043bb9bd60340a6a915aa~mv2.png/v1/fit/w_473,h_156,al_c,q_80/file.png" length="0" type="image/png"/><dc:creator>simpletechtrend</dc:creator></item><item><title><![CDATA[光學通訊技術生命週期]]></title><description><![CDATA[將 1M 與 10M 的量產里程碑疊加在時間軸上，我們能清楚看見技術普及的「加速度」。在 10G 世代，供應鏈有餘裕花 10 年達到百萬顆，再花 5 年推進到千萬顆；然而，到了 800G 的 AI 爆發期，不僅達到百萬顆的時間被極限壓縮至 1 年，連千萬顆的量產預期也被強迫縮短至 5 年內完成。這無疑是對先進封裝、測試良率與零組件產能的一場終極壓力測試。]]></description><link>https://www.simpletechtrend.com/post/supercycle-of-optical-communication</link><guid isPermaLink="false">69c37bbc653657f03d5bf1e4</guid><pubDate>Wed, 25 Mar 2026 06:09:45 GMT</pubDate><dc:creator>simpletechtrend</dc:creator></item><item><title><![CDATA[技術文章分析 | 突破 CPO 耦合瓶頸：AuthenX 以超穎透鏡實現 +/- 18 um高容差對準]]></title><description><![CDATA[矽光子耦合不再是噩夢！AuthenX 在 OFC 2026 揭露 Meta-lens 耦合方案，將對準容差放寬至 $\pm18~\mu m$。透過雙透鏡準直設計，不僅確保了高斯光束的高品質傳輸，更為 CPO 的量產與可拆卸連接鋪平了道路。]]></description><link>https://www.simpletechtrend.com/post/ofc2026-authenx-meta-lens-cpo-coupling-tolerance</link><guid isPermaLink="false">69c382f236a1fdc193c054d8</guid><category><![CDATA[Technical Articles]]></category><pubDate>Tue, 24 Mar 2026 16:00:00 GMT</pubDate><enclosure url="https://static.wixstatic.com/media/82206f_d9181fd6b7f342e0a63b7fe4d679159d~mv2.png/v1/fit/w_479,h_156,al_c,q_80/file.png" length="0" type="image/png"/><dc:creator>simpletechtrend</dc:creator></item><item><title><![CDATA[OFC2026 - 密集成接與液冷架構的演進：從 XPO 模組看 AI 資料中心互連變革 - Amphenol]]></title><description><![CDATA[Amphenol 在 OFC 2026 展示了 AI 資料中心的互連未來：XPO 模組以 8 倍於 OSFP 的密度與內建液冷架構，挑戰 CPO 的領先地位。在 224G 邁向 448G 的關鍵時刻，頻寬、熱管理與低延遲 LPO 方案正重塑產業鏈佈局。]]></description><link>https://www.simpletechtrend.com/post/ofc2026-amphenol-xpo-liquid-cooling-ai-connectivity</link><guid isPermaLink="false">69c1d30b8f0e652aaa2ce61d</guid><category><![CDATA[Tech Conference Notes]]></category><pubDate>Mon, 23 Mar 2026 23:57:33 GMT</pubDate><enclosure url="https://static.wixstatic.com/media/82206f_8b2b86bae10f4a00b63d9767a618b806~mv2.jpg/v1/fit/w_1000,h_1000,al_c,q_80/file.png" length="0" type="image/png"/><dc:creator>simpletechtrend</dc:creator></item><item><title><![CDATA[OFC 2026 - TFLN 產業拐點成真：量產規模化與 1.6T/3.2T 佈署路徑 - Hyperlight, Broadcom, Ciena, Eoptolink, Jabil]]></title><description><![CDATA[ TFLN 正式跨入 1.6T 量產元年！從哈佛實驗室到 UMC 8 吋產線，TFLN 憑藉超高頻寬與極低功耗，成為解決 AI 算力基礎設施節能關鍵]]></description><link>https://www.simpletechtrend.com/post/ofc2026-tfln-scaling-1-6t-deployment-analysis</link><guid isPermaLink="false">69c1d00436a1fdc193bc7d54</guid><category><![CDATA[Tech Conference Notes]]></category><pubDate>Mon, 23 Mar 2026 23:48:47 GMT</pubDate><enclosure url="https://static.wixstatic.com/media/82206f_8bce814ae6e0435e955cb1622f9110c6~mv2.jpg/v1/fit/w_1000,h_1000,al_c,q_80/file.png" length="0" type="image/png"/><dc:creator>simpletechtrend</dc:creator></item></channel></rss>