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simple_tech_trend | stt@simpletechtrend.com

Front-line analysis of optical interconnect, silicon photonics and the AI infrastructure supply chain.
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OCP Global Summit 2026 | Luxshare-Tech | Andrew Kim, Jinhua Chen | Copper Interconnect Innovations for Realizing 400G Electrical
The 448G copper bottleneck has moved: Luxshare-Tech's chip-side CPC is resonance-free to 110 GHz, close to PAM4's 112 GHz, but links with first-gen external twinax-to-twinax connectors stay clean only to 100 GHz. First-gen passive copper will likely start on PAM6, under 1 m.
3 minutes ago


OCP Global Summit 2026 | Molex, Broadcom | Clay Miller, Rajesh Annapillai | 224G AECs for AI Data Centers
At 224G, passive copper shrinks to 1 m and the 1-6 m zone belongs to AECs. Molex and Broadcom's answer is not thicker wire but skew specs, co-simulation and retimer telemetry; 1.6T AECs ramp in 2027 and overtake 800G only in 2030.
1 day ago


OCP Global Summit 2026 | Broadcom | Asad Khamisy | Ethernet Scale-up, Copper and OCI
At the same 500 m, pluggables draw 23 pJ/bit while OCI needs 7, a gap of about 230 W per XPU. Broadcom says Ethernet scale-up is in production, copper gets one more in-rack generation with 400G PAM6, and optics must match copper power to enter.
3 days ago
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