AI-driven demand for 800G/1.6T optical modules is turning InP substrates, PD/LD packaging and rare-earth policy into the industry's key inflection points. We break down substrate expansion, export-control risk and packaging trends through to OIO.

1.6T is a generational shift up from 800G. Tear down both modules side by side: DSP goes from 80 to 130, each light source costs 3-4x more, and SiPh penetration rises from 40-45% to 60%. See where cost jumps, how the bottleneck moves, and who takes the margin.

AI servers are reshuffling the optical communications industry. This preview maps the supply chain from lasers, photodetectors, DSPs and silicon photonics to optical engines and transceiver assembly, and shows where the real moats sit.

Is co-packaged optics ready to displace pluggable transceivers? We break down where CPO really stands, how Broadcom and NVIDIA are approaching it, and which players in Taiwan's supply chain are positioned to win.