AIST × KYOCERA have lit up the long-shelved AOP concept for the first time: an embedded SiPh chip, polymer ORDL and 3D micro-mirrors deliver 112 Gbps PAM4 with 3.35 dB TDECQ, passing IEEE specs. How far has the polymer optical-redistribution route come?

KYOCERA breaks low-loss coupling for CPO modules into three parts: face-down cooling, a curved mirror and a wide-tolerance core. Coupling loss halved to 1.22 dB, ±5 µm tolerance, error-free from 0 to 70°C. Why can't you judge a coupling module by a single loss number?