CPO shifts value from module assembly to advanced packaging, and the biggest winners are not legacy module makers but foundries and OSATs with silicon photonics and advanced packaging capabilities. Taiwan's ecosystem is regrouping around them, and standardization will decide the outcome. But pluggables are still growing, and the steering wheel remains in the hands of the platform giants.

Twenty-four sessions at OCP APAC 2026 told the same story: the AI infrastructure bottleneck is shifting from how fast you compute to whether you can connect it and keep it running. Here is the full map, with an index of all 24 session notes.

At this Computex, optics was no longer a supporting act. From NVIDIA's Photonics CPO to Taiwanese silicon photonics optical engines and liquid-cooled racks, the whole supply chain showed up. Floor photos of the optics hidden inside the racks.

An exclusive 2026 map of the optical communications and CPO/silicon photonics supply chain — from EIC design and optoelectronic component manufacturing to optical modules and advanced packaging and test — covering NVIDIA, TSMC and other key suppliers alongside promising startups in the AI infrastructure investment matrix.