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IPEC Webinar - From the CPO Vision to the NPO Reality: Technology Paths and Industry Dynamics of Near-Packaged Optics in AI Compute Clusters - Tencent, Alibaba, Ranovus, Coherent, Ciena, Huawei
As copper interconnects hit their physical limits, NPO is emerging as the practical lifeline for AI compute clusters. Tencent and Alibaba plan to start 3.2T NPO deployment by late 2026, while Huawei proposes a 7.2T spec aligned with GPU roadmaps.
2 days ago
OFC 2026 - Entering the 200G/Lane Era: STMicroelectronics Unveils PIC100, Its 300mm Backside-Integrated Silicon Photonics Platform - STMicroelectronics (ST)
At OFC 2026, STMicroelectronics launched its PIC100 platform, using a unique backside integration process to break the physical limits of the buried oxide layer. It delivers ultra-low-loss edge couplers and 80GHz photodetectors, signaling that 200G/lane silicon photonics has officially reached volume production.
2 days ago
Articles: Blog2
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