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OFC 2026 - AI Interconnect Scale-Up and CPO Reliability Deep Dive - Meta Platforms
When does copper run out? At OFC 2026, Meta answered with 90 million device-hours of field data: CPO cuts link power by 65% and, excluding one fixable component issue, is more than 10x more reliable than pluggable modules.
2 days ago
OFC 2026 - 16-Wavelength 800-Gbps Bidirectional Silicon Photonics Interconnect - Lightmatter
Silicon photonics leader Lightmatter unveiled microring-based 800G/1.6T interconnect technology at OFC 2026. It tackles thermal compensation in AI compute environments and, through 3D-stacked packaging and integration with the TSMC/ASE ecosystem, marks a new milestone for silicon photonics commercialization.
2 days ago
Technical Article Analysis | Broadcom 200G VCSEL Deep Dive: NPO, the Power-Saving Weapon for AI Scale-Up Networks
Broadcom's latest 200G VCSEL paper reports over 35 GHz bandwidth and about 1 pJ/bit efficiency, paired with a new NPO architecture aimed at replacing copper in AI scale-up networks. We walk through all 12 figures.
2 days ago
Paper Analysis | Integrated Glass Waveguide Substrate with Surface-Coupled Photonic Chips for Massive CPO Scaling
Glass substrates are making a comeback. Corning's latest OFC 2026 paper shows a glass interposer with embedded IOX waveguides and electrical interconnects that assembles a silicon photonics PIC in under 5 minutes and targets 8 Tb/s bandwidth density for AI-era interconnects.
2 days ago
OFC 2026 - Scaling the Optical Future: How Optics Defines the Foundation of AI Compute - Coherent
In the AI data center era, optics has moved from supporting role to center stage. Coherent's CTO showed a 150x gain in bandwidth density over 20 years and a far shorter ramp for 1.6T modules, while the CPO-versus-pluggable debate shapes the next decade of compute infrastructure.
2 days ago
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