600mm panels give FOPLP high utilization but warp easily during assembly. ASE's hybrid flow — RDL on 600mm panels, assembly on 300mm panels — delivers 7.1x productivity at low risk, with 3-layer 5/8µm RDL, ±5µm placement accuracy and passing 3x/6x reflow. A pragmatic panel route for AI packaging.

Whether AI systems can ship no longer depends on process technology alone, but on integrating compute, optics and power at volume. ASE's CP Hung spelled out this shift with his “advanced packaging trilogy” — and as the battlefield moves from scaling to integration, Taiwan's supply chain holds a stronger hand.