SiTime's Q2 revenue doubled while margins jumped, and CED posted its ninth straight quarter of triple-digit growth. With Renesas' timing business folded in, Q3 guidance leaps to $285–295M. This is no longer "MEMS vs. quartz" — it's precision timing becoming a toll booth on AI infrastructure.

MACOM posted a record quarter with all three end markets growing and book-to-bill at an all-time-high 1.6. It sells chips, not modules, yet sits inside every optical interconnect architecture. Here are the hard numbers and management's real signals in three minutes.

AMD's OCP keynote was framed around open standards, but the line worth underlining is the CPU-to-GPU ratio converging from 1:4 toward 1:1. Agentic workflows hand orchestration, retrieval and tool execution back to the CPU — and that matters far more to Taiwan's rack-integration and scale-up optical interconnect supply chain than a slide full of open acronyms.

Google's fungible data center lets one facility host any generation of TPU, GPU, or CPU. As OCP standardizes power, cooling, and facility specs, Taiwan's thermal and power suppliers face a new spec-in battle, and the ticket in is OCP: a higher bar than capacity.

At OFC 2026, WIN Semiconductors showed what it takes to be the world's leading III-V foundry: tight control of trench etch and oxide aperture underpins a VCSEL supply chain of millions of wafers, while it builds out advanced processes for CPO and autonomous driving.

TFLN enters its first year of 1.6T volume production. From a Harvard lab to UMC's 8-inch line, thin-film lithium niobate's ultra-high bandwidth and low drive voltage make it a key lever for power efficiency in AI infrastructure.