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ECTC 2026 | Keio University | Low-Loss Polymer Waveguide Device for Fiber-to-Chip and Chip-to-Chip Connection
Keio University's "Mosquito method" draws light paths into polymer with a single needle, using a graded-index core to avoid interface scattering for near-material-limit loss — and uses fluid dynamics to beat the needle-size limit for 20 µm pitch. What is the open question for the polymer waveguide route?
2 days ago


ECTC 2026 | AIST | Proposal of a Novel Opto-Electronic Fan-Out Wafer-Level Packaging Based on Optical RDL and Opto-Chiplets
CPO volume production is held back by micro-lens pick-and-place and active alignment. AIST turns the lens-mirror into an opto-chiplet embedded during molding, routes light with an Optical RDL, and widens alignment tolerance to ±12 µm.
2 days ago


ECTC 2026 | AIST × KYOCERA | Demonstration of an Optical Packaged Substrate with Embedded Silicon Photonic Transceiver for High Performance Chiplet Packaging
AIST × KYOCERA have lit up the long-shelved AOP concept for the first time: an embedded SiPh chip, polymer ORDL and 3D micro-mirrors deliver 112 Gbps PAM4 with 3.35 dB TDECQ, passing IEEE specs. How far has the polymer optical-redistribution route come?
2 days ago
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