AMD has officially shifted its center of gravity from "PC + server" to the AI data center, with Data Center alone taking 58% of revenue. The real signal is the 2027 guidance - Data Center more than doubling, server CPU up over 70% - and Helios pins down the timeline for optics entering the rack. For the optical supply chain, demand visibility now extends into 2027.

AMD's OCP keynote was framed around open standards, but the line worth underlining is the CPU-to-GPU ratio converging from 1:4 toward 1:1. Agentic workflows hand orchestration, retrieval and tool execution back to the CPU — and that matters far more to Taiwan's rack-integration and scale-up optical interconnect supply chain than a slide full of open acronyms.

Meta, Broadcom and AMD jointly define the OCI 200G line interface spec, betting scale-up optical interconnect on micro-ring DWDM, bidirectional single fiber, external lasers and NRZ. It is a buyer-supplier alliance taking on NVIDIA's vertical integration, and its external laser clause draws a clear spec for CW DFB and ELSFP suppliers.

As AI models head toward Yottascale, optical interconnect architecture faces an unprecedented shift. From soldered to socketed, from external lasers to optical backplanes, how are Meta, AMD, Microsoft and other giants defining the next AI interconnect standard?

Scale-up bandwidth is nearly an order of magnitude larger than scale-out, and once copper hits its limit, optics goes from option to the only answer. A full breakdown of AMD's Matthew Streshinsky talk at NTU, including how the 16-wavelength micro-ring chiplet works and the live Q&A.