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Paper Analysis | Breaking the 400G-per-Lane Limit: Component and System Tradeoffs in IM/DD Interconnects | Coherent
The 400G-per-lane era is here. At OFC 2026, Coherent showed InP components with more than 100 GHz of bandwidth - but how do you keep TDECQ low while absorbing a 5 dB sensitivity penalty? A deep dive into the technical and commercial tradeoffs of IM/DD for AI interconnects.
2 days ago


OFC 2026 - Ethernet's Accelerating Evolution for AI: 400G per Lane and the Road to 6.4T - Meta, Cisco, Synopsys, Dell
AI compute demand is forcing Ethernet to evolve faster than ever, and OFC 2026 marked the official start of 400G-per-lane work. Experts from Meta, Cisco, Synopsys and Dell'Oro explain how 1.6T and 3.2T networks will scale under hard power and space limits.
2 days ago


Paper Analysis | Intel Takes VCSEL CPO Below 1 pJ/b: A Full Circuit Breakdown from 4×50G NRZ to 108G PAM4
Silicon photonics gets the spotlight, but Intel's 0.9 pJ/b 108G PAM4 link shows VCSELs remain an underrated low-power path for short-reach CPO. We walk through this CICC 2026 paper section by section, figure by figure, and identify the last three miles VCSEL CPO must cover to reach volume: equalization, packaging and thermals.
2 days ago


VLSI 2026 | Paper Analysis | Marvell Pushes a 3nm FinFET 212.5Gbps SerDes to 55dB Reach and 2.05pJ/bit: The Longest-Reach, Most Efficient Yet
Marvell's 3nm FinFET 212.5Gbps SerDes hits 54.7dB reach and 2.05pJ/bit, the longest-reach and most efficient published at this rate. A shared PLL plus heavy DSP equalization breaks the old rule that reach costs power, giving 1.6T racks structurally more room in cable length and power budget.
2 days ago


Technical Paper Analysis | Breaking the 100GHz Bottleneck: 400G/lane EMLs and Advanced Packaging for GPU Clusters
AI compute is ushering in the 3.2T optical era. We break down Mitsubishi Electric's latest paper: a 0.8 µm high-mesa EML, a Glass-AlN hybrid substrate, and wire-bond-free packaging that push modulation bandwidth past 100 GHz for next-gen CPO and GPU clusters.
2 days ago


Computex 2026 Keynote: The Copper Wall Is Moving Into the Rack — Marvell Spells Out the Physical Timeline for Optics
Jensen Huang declared that "compute has been disaggregated"; Matt Murphy supplied the missing physical timeline. AI's next bottleneck is connectivity, and the deciding factor is a copper wall moving into the rack. Every doubling of bandwidth halves copper reach — at 400G/lane, copper can't even span a single rack, and physics forces CPO from slideware into shipments.
2 days ago


Technical Article Analysis | Broadcom 200G VCSEL Deep Dive: NPO, the Power-Saving Weapon for AI Scale-Up Networks
Broadcom's latest 200G VCSEL paper reports over 35 GHz bandwidth and about 1 pJ/bit efficiency, paired with a new NPO architecture aimed at replacing copper in AI scale-up networks. We walk through all 12 figures.
2 days ago


Datasheet fs Numbers Can Mislead You: What Six 312.5 MHz Clocks Reveal About the 1.6T/3.2T Clock Bottleneck
17, 25, 30, 38, 72 fs: at least two things about these six 312.5 MHz-class clock datasheets can mislead you. After the receiver equalizer, their TDECQ is nearly identical. The real clock bottleneck only hits at 448G/lane.
2 days ago
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